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Data center cooling systems have undergone a major transformation in the persistent pursuit of better performance and lower energy use. Liquid cooling systems, particularly direct-to-chip systems, have emerged as a promising solution to address the increasing heat dissipation challenges. One critical component of such systems is the filtration mechanism, responsible for safeguarding the integrity and efficiency of the cooling process. These factors are pivotal in ensuring the reliable and sustainable operation of liquid cooling systems in high-demand applications, where electronic components continually push the boundaries of heat generation. This study undertakes a thorough examination of filters of different mesh size used in direct-to-chip liquid cooling systems. The research is multifaceted, encompassing the evaluation of filter performance, pressure drop characteristics, and long-term durability. The methodology employed in this research combines testing with a coolant distribution unit and rack setup to provide a holistic perspective on filter functionality. Findings from this study shed light on the key parameters that influence filter performance. Ultimately, the results of this research promise to contribute significantly to the advancement of direct-to-chip liquid cooling systems, facilitating the continued evolution of electronics in diverse fields, such as high-performance computing, data centers, and emerging technologies. With a focus on enhancing system reliability, efficiency, and sustainability, this study seeks to provide a valuable resource for engineers and researchers in the pursuit of effective cooling solutions for cutting-edge electronic applications. 

Abstract The increasing demand for high-performance computing in applications such as the Internet of Things, Deep Learning, Big data for crypto-mining, virtual reality, healthcare research on genomic sequencing, cancer treatment, etc. have led to the growth of hyperscale data centers. To meet the cooling energy demands of HPC datacenters efficient cooling technologies must be adopted. Traditional air cooling, direct-to-chip liquid cooling, and immersion are some of those methods. Among all, Liquid cooling is superior compared to various air-cooling methods in terms of energy consumption. Direct on-chip cooling using cold plate technology is one such method used in removing heat from high-power electronic components such as CPUs and GPUs in a broader sense. Over the years Thermal Design Power (TDP) is rapidly increasing and will continue to increase in the coming years for not only CPUs and GPUs but also associated electronic components like DRAMs, Platform Control Hub (PCH), and other I/O chipsets on a typical server board. Therefore, unlike air hybrid cooling which uses liquid for cold plates and air as the secondary medium of cooling the associated electronics, we foresee using immersion-based fluids to cool the rest of the electronics in the server. The broader focus of this research is to study the effects of adopting immersion cooling, with integrated cold plates for high-performance systems. Although there are several other factors involved in the study, the focus of this paper will be the optimization of cold plate microchannels for immersion-based fluids in an immersion-cooled environment. Since immersion fluids are dielectric and the fluids used in cold plates are conductive, it exposes us to a major risk of leakage into the tank and short-circuiting the electronics. Therefore, we propose using the immersed fluid to pump into the cold plate. However, it leads to a suspicion of poor thermal performance and associated pumping power due to the difference in viscosity and other fluid properties. To address the thermal and flow performance, the objective is to optimize the cold plate microchannel fin parameters based on thermal and flow performance by evaluating thermal resistance and pressure drop across the cold plate. The detailed CFD model and optimization of the cold plate were done using Ansys Icepak and Ansys OptiSLang respectively.